Production process
1. Cleaning: use ultrasonic wave to clean PCB or LED bracket and dry it.
2. Rack mounting: prepare the silver glue on the bottom electrode of the LED die (wafer) and expand it. Place the expanded die (wafer) on the spinel table, install the die on the PCB or the corresponding pad of the LED support one by one with a spinel pen under the microscope, and then sinter it to solidify the silver glue.
3. Pressure welding: use aluminum wire or gold wire welding machine to connect the electrode to the LED tube core as a lead for current injection. Aluminum wire welding machine is generally used for led directly installed on PCB.
4. Packaging: protect the LED core and welding wire with epoxy through dispensing. Dispensing glue on PCB board has strict requirements on the gel shape after curing, which is directly related to the brightness of the finished backlight. This process will also undertake the task of phosphor (white LED).
5. Welding: if the backlight adopts smd-led or other encapsulated led, the LED needs to be welded to the PCB before the assembly process.
6. Film cutting: use a punch to die cut various diffusion films, reflective films, etc. required by the backlight.
7. Assembly: according to the requirements of the drawing, manually install various materials of the backlight in the correct position.
8. Test: check whether the photoelectric parameters and light output uniformity of the backlight are good.
9. Packaging: package and store the finished products as required.